The response and thermotolerant mechanism of Agaricus bisporusunder high temperature stress

WANG Qian, HUANG Jian-Chun, BU Le-Nan, HAO Hai-Bo, JUAN Jia-Xiang, XIAO Ting-Ting, CHEN Hui, ZHANG Jin-Jing

Mycosystema ›› 2021, Vol. 40 ›› Issue (6) : 1400-1412.

PDF(1088 KB)
Chinese  |  English
PDF(1088 KB)
Mycosystema ›› 2021, Vol. 40 ›› Issue (6) : 1400-1412. DOI: 10.13346/j.mycosystema.200386
Research papers

The response and thermotolerant mechanism of Agaricus bisporusunder high temperature stress

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 40(6): 1400-1412 https://doi.org/10.13346/j.mycosystema.200386

References

Publishing order | Descend order by publishing year | Descend order by cited within

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(1088 KB)

Accesses

Citation

Detail
Sections
Recommended
Address: Edited by United Editorial Office for Journals, Institute of Microbiology, CAS, No. 1 West Beichen Road, Chaoyang District
postcode:100101
E-mail for consultation: jwxt@im.ac.cn
Manuscript consultation phone: +86-10-64807521
Advertising email: gg@im.ac.cn
Email address: bjb@im.ac.cn
Advertising/distribution tel: +86-10-64806142
科微学术
菌物学报
Copyright © Mycosystema, All Rights Reserved.

/

〈 〉